LeTV LeEco Le Max 3 Specifications exposed

LeTV does not intend to withdraw from the smart phone industry, according to the latest report. And LeEco's next flagship machine -- LeTV LeEco Le Max 3 phone will be available soon. A foreign media SlashLeaks exposed a series of LeEco Le Max 3 phone real phone photos today.

LeEco Le Max 3 design keeps in line with LeTV's usual tone of the phone. This smsrtphone is much closer as the LeEco Le Max 2 that has been launched in 2016. Front panel adopts a visual borderless design,and the back uses dual rear camera and fingerprint recognition module.

This LeEco Max 3 mobile phone will be equipped with a 5.7-inch screen, with 6GB / 8GB RAM + 64 GB / 128GB ROM. On performance, it will not adopt the latest Snapdragon 835 processor, while the Snapdragon 821 processor. On system, it may also introduce some of the relevant factors of artificial intelligence.

LeTV LeEco Le Max3 phone photos have been leaked recently, including the front and the back appearance of this new flagship. From the exposed real machine, the LeEco Max 3 flagship mobile phone is featued with dual back camera design as well as the fingerprint identification module.

Moreover, news also showed that this new LeEco Phone will integrate part of the AI function. More news please stay tuned for our later report.

Source: http://www.androidmall.co.uk/blog/letv-leeco-le-max-3-specs-exposed/

LeTV LeEco Dual 3 will be released in November

LeTV's advertisement for this phone announced"LeAI·November 2016 BeiJing", which indicated that this LeEco Dual 3 mobile phone will be launched in November in Beijing. As for the LeTV Dual 3 specific release date, it is still unknow.

LeTV Official has ever exposed a gold color for this phone, and now a black version phone spy photos also exposed online. Judging by the photos, the black version LeTV Dual 3 back shell is biased on the matte texture, which is full of mysterious effect.

Rumors also showed that the LeTV Le Dual 3 smartphone will have a similar "tile force" machine main camera, and add the Artificial Intelligence Technology, support 4X optical zoom, and built in MTK deca core processor,or the new Helio X27 processor. Source from: http://www.letvmobileshop.com/news/letv-leeco-dual-3-will-be-released-in-november/

LeTV LeEco Dual 3 comes with Helio X27 CPU

Except for the two new products that have been released in United States, LeTV Mobile is said to take a next big action -- a new product that will be loaded with LeAI artificial intelligence new concept is about to debut, that is the LeTV LeEco Dual 3 mobile with personalized dual-master design, which has been confirmed that it will be officially released on November.

Before LeTV Dual 3 phone release, there are many rumors about this smartphone. Recently several suspected LeTV Dual 3 phone spy phone photos have been exposed online, which first confirmed that the processor model of this phone.
Above photo is just the LeTV Dual 3 latest spy photo, from which we can see it is carried with EUI 5.8 OS, and Helio X27 deca core processor, with 2.6GHz main frequency.

However, LeTV Official has never announced any infos about the Helio X27 processor. Many thought it is the upgrade version of the Helio X25 processor, while X27 will have a better performance. But the process technology and three ten-core architecture of the Helio X27 will not change.
LeTV Dual 3 "Smile" face dual rear back camera design is very attracting. Moreover, it also first adopts the famous curved antenna technology, which is very different from its previous models of LeTV Le 2.

Source from: http://www.letvmobileshop.com/news/letv-leeco-dual-3-comes-with-helio-x27-cpu/

LeTV LeEco Le Pro 3 Review

Except for the powerful Snapdragon 821 processor, the LeTV Le Pro 3 mobile is also the lowest price products among Snapdragon 821 mobiles. Well, how is the Snapdragon 821 processor? Let's have a deep look at.
LeTV Le Pro 3 Configurations
As many other domestic manufacturers' flagships, the LeTV Le Pro 3 mobile also launches two models, including the standard version: 4GB RAM+32GB ROM, and the high version: 6GB RAM+64GB ROM, both storage use the UFS2.0 Flash memory. And on the other configurations, they are the same: Snadragon 821 CPU, 5.5 inch OGS 1080P screen, and equipped with 8.0MP front camera + 16.0MP back camera, 4700mAh battery, and support Infrared remote control function. And it is pre-installed with EUI 5.8, based on Android 6.0.1 OS.
Snapdragon 821 Processor
As the first Snapdragon 821 mobile in domestic phone market, and the second Snapdrgon 821 mobile in the world except for the ZenFone 3 Deluxe, now let's have a look at the powerful processor of this model.
On the Architectural aspect, there are not to many differences between the Snapdragon 821 and 820 processor. Both are quad core Kyro architectural and Adreno 530 GPU. While the Snapdragon 821 processor has a little promotion on the main frequency. The performance of the two cores has being more narrow, as a result, it will provide higher performance under the same demand in our daily use.
On Baseband, Snadragon 821 and 820 processor is the same. Both are equipped with X12 LTE modem baseband, support Cat.12 / 13, highest support for 600Mbps downlink high-speed network, upload up to 150Mbps, carrier aggregation support downlink 3 * 20MHz, uplink 2 * 20MHz.
Although the Snapdragon 821 and 820 processors are almost the same on parameter, Snapdragon 821 is not just a simple frequency increase. The new processor have shorter boot times and faster application loading, as well as improved on thermal and power consumption over the 820 after optimized. At the same time, VR SDK, dual PDAF, laser focus range expanded, etc, also make it  is not  only an Enhanced Edition of the Snapdragon 820.
Run sub-results

Here is the LeTV Le Pro 3 6GB 64GB high version Run sub-results.
Before the Run sub-results, let's have a look at the detailed parameter. On frequency, we can see that the 2x1.6GHz+2x2.2GHz combination on Snapdragon 820 has changed into 2x2.19GHz+2x2.34GHz, and GPU frequency also changed into 652MHz, in view of it, this is a Snapdragon 821 processor, not 820. But we have to say that the relationship between the two processors is not general.
After all, the Snapdragon 821 processor is relatively bright on the run points.
AnnTuTu score is close to the 16 million as propagandist, of which CPU performance is about 3.5 million. Geekbench single-core fraction of 1832, multi-core fraction of 4433. The processor upgrade is over 2 to 3 million than Snapdragon 820 model, the difference in the experience is not great, unless using some of the more stringent performance of application, it will be reflected in the speed gap.
On Graphics performance, we hae run three times 3DMark in the case of low power, middle power and full power, LeTV Pro 3 can gain nearly 2700 scores on SLING SHOT ES3.1 test except for low power mode (about 10% power). Though slightly worse than Pixel C and Shield TV which use of NVIDIA Tegra processor, but higher than Galaxy S7 mobile with Snapdragon 820 processor and be the top.
Under the Manhattan 1080p off-screen and T Rex1080p off-screen tests, the LeTV LeEco Le Pro3 mobile achieved 49.0FPS / 94.0FPS results, this slightly overclocked Adreno 530 brought about four of the upgrade. On the performance list, it is almost the same as the Xperia XZ which also adopts Snapdrgon 821 processor.
However, the read and write performance is not so brisk, just at the level of the current flagship machine. With the UFS2.0 flash storage media, the LeTV Le Pro3 4K random read speed reaches up to 99.73MB / s, and read speed reaches up to 16.34 MB / s.
Game performance measurement
From CPU / GPU occupation, Snapdragon 821 CPU is sure to meet the demand of the current popular games, The maximum occupancy is about 40%. While running three games, GPU occupancy is around 50% to 80%. Compared to the Snapdragon 820 processor which uses the same Adreno 530 GPU, the GPU occupancy rate and the number of frames have been significantly improved. In the actual gaming experience, Snapdragon 821 has a better performance than Snapdragon 820.
Test Screenshots
Summary
After the actual test, LeTV Le Pro3 Snapdragon 821 processor has a satisfactory performance. First, after a long time running games, the body temperature is only a degree of warmth, and no hot feeling as metal body mobile phone. Second is the game cut out the system desktop and seamless process of cutting back, you no need to deliberately wait for the system ready. Thirdly, because Snapdragon 820 has been introduced for a time, and its relevant optimization has been done very well, so there is no Caton or the wrong screen trouble on Snapdragon 821 under the optimization degree of the games than the new architecture processor. Overall, the LeTV LeEco Le Pro 3 performance is quite good.

Source from: http://www.letvmobileshop.com/news/letv-leeco-le-pro-3-review/

LeEco Le 2S Real Phone Spy Photos Leaked

Last month, before the LeTV new conference, news showed that LeTV Le 2's updated version -- LeTV Le 2s will be released, and the machine has appeared on the Ministry of Industry, but what has debuted at the conference LeTV Le Pro 3 Snapdragon 821 processor. And now, the LeTV Le 2s spy photos have been exposed, perhaps it will be released soon.
 
Judging from the spy photo, it has almost the same appearance as the photo on Ministry of Industry. The front continues LeTV's ID borderless design, and the back shell adopts the metal material. One highlight is the dual rear camera location. LeTV Le 2s dual rear camera with the flashlight make up a "Smile" facial expression.
 
As for the specs, LeTV Le 2s uses a 5.5 inch 1080P screen, carried with MTK Helio X25 processor, builds in 3GB RAM + 32GB ROM, has 13MP dual rear cameras + 8.0MP front camera, and built in a 3900mAh battery, pre-installed with Android 6.0 OS.

Source from:
http://www.letvmobileshop.com/news/leeco-le-2s-real-phone-spy-photos-leaked/

LeEco Coolpad Cool2 Phone Exposed

Rumors showed that the Meizu Pro 6s will be built-in MTK P20 processor. At the same time, data on AnTuTu benchmark for the Coolpad A9s-9, also indicated that it will use the MTK MT6757 Helio P20 octa core processor, and this A9s-9 model has gained network certification.

Latest news about the Coolpad A9s-9 showed it will belong to the Cool new flagship, or maybe the new Cool2 model.

The same as the network card photo, the real machine spy photos of the Cool A9s-9 has a front of MAX charm, back design is particularly similar to the three-stage metal body, the main camera, fingerprint key are all at the back vertical center position. Front is the "Coolpad" LOGO. According to the network information display, this new mobile will have 7.85mm slim thickness, while built-in a 3800mAh high-capacity battery!

The most noteworthy is that it is equipped with MediaTek MT6757 helio P20 octa-core processor, with 16nm process, support LPDDR4 memory, using the same GPU as the Helio X200. It still have full-mode, Cat.6 capabilities. Other known specifications include 5.5-inch 1080P screen, 6GB of memory and 64GB of storage space and 12 million pixel master photo, etc., also support the whole Netcom.

With the emergence of more news, there is a higher possibility of Cool launching the first domestic MT6757 mobile phone , but taking into account the network A9s-9 hit is cool standard, the aircraft will eventually be the new eco-mobile phones as new identity available is still suspense.

Source from:
http://www.letvmobileshop.com/news/leeco-coolpad-cool2-phone-exposed/

LeTV Le Pro 3 Phone Review

LeTV Le Pro 3 Phone has been officially launched on September 21, which is the second Snapdragon 821 mobile in the world, and the world's volume production first Snapdragon 821 model in China.

LeTV Pro 3 phone continues many ID design of LeTV's previous two LeTV Le One and Le Two models, such as no screw ID, no border ID, Type-C, Uni-body and so on. Moreover, it has been upgraded on the processing, which adopts the unique  drawing and polishing process to achieve ceramic glaze delicate texture.
On LeTV LeEco Le Pro3 camera specs, it is equipped with 16-megapixel rear camera and 800 million pixels front camera, among which, the 16 million pixel rear camera enables 400 milliseconds limit of imaging speed.
It also add NFC function, which can realize reading cards, writing cards, card emulation and P2P mode. It can not only support NFC near-field payments, prepaid bus card, but can also achieve more convenient operation in many scenarios.
The whole width is only 73.9mm, which is the world's narrowest 5.5 inch phone. Meanwhile, 7.5mm fuselage is much thinner.
Battery capacity also increased to 4070mAh, among 5.5-inch screen and 4000mAh + capacity mobiles it is the most slim.
0.1s ultra fast focus, camera startup only 0.6s. In addition, it also add the smart scene detection function, which can intelligently analysis the current scene, judges blocked shots, night, jitter (or scene motion), or high-motion scenes in 30s.
In the night view, the LeEco Le Pro 3 performance is more outstanding. When detecting of night mode, it will open the night preview enhancement.
LeTV Le mirror fingerprint has been also used on Letv Pro 3, which supports 360 degree full angle recognition, 5 groups of fingerprint input, owning a very high accuracy and corresponding speed, support cold screen unlock, fingerprint camera, fingerprint payment and privacy mode.
Except for the performance improvement Le Pro 3 also has excellent battery life. It is built in a 4070mAh capacity battery, support Qualcomm QC 3.0 fast charge protocol, and can achieve 24W, dual fast charge functions. At the same time, it is featured with no gear voltage regulation technology, which can automatically adjust the charging rate, to ensure a maximum power during the full charge processing, and effectively control charging temperature.
LeEco Le Pro 3 smartphone supports 7 modules 27 frequencies, support global full netcom,support the vast majority of the world's international and regional network standard and frequency band.
Moreover, it also supports dual sim card dual standby dual 4G network, 4G +, VoLTE and 5G WiFi MIMO dual-band dual antenna and other functions. The maximum downlink reaches up to 600Mbps high-speed network, is twice the speed of 2CA mobile Network and single antenna WIFI.
7.5mm ultra slim fuselage, which battery capacity has increased to 4070mAh, in the 5.5-inch screen and 4000mAh + capacity mobiles, it is the most slim, and owning largest capacity battery  among the Snapdragon 820/821 mainstream models.
Gold wax polishing process, the back shell has been finely processed with 58 minutes CNC technology, gradually carving out 33 grams of metal shell from more than 400 grams of aluminum alloy material.

Source from:http://www.letvmobileshop.com/news/letv-le-pro-3-phone-review/

LeTV LeEco Le Pro 3 has been released

LeTV Mobile has officially released its new LeTV LeEco Le Pro 3 mobile on September 21. One of the higlights is the Snapdragon 821 processor. Moreover, this new mobile has "Faster, Thinner, Longer" three features. It has four models and will be on sale since September 28.
LeTV Le Pro 3 Mobile phone adopts full metal material and unibody design, which has the same overall style as its preamble product, such as LeTV Le 2, Le 2 Pro and Le Max 2 models. Meanwhile, it also uses the 2.5D arc glass and coating process on the back shell. The whole width of the machine is only 73.9mm. The main screen is LeEco Logo breathing light, and the fingerprint identification button is located at the back shell, also cancelled the 3.5 mm headphone jack.

On Configurations it is carried with Snapdragon 821 processor, and equipped with a 5.5 inches 1080p resolution In-cell touch screen. 8.0MP F2.2 aperture front camera, rear camera 16 million pixel, with 6P Lens, F2.0 aperture, and supports phase focusing, dual color temperature flash, built-in 4070mAh battery, and support 24W QC3.0 fast charge, running EUI5.8 based on Android M OS, and supports dual Nano SIM card dual standby.

The LeEco Le PRO 3 mobile has four versions, including 4GB RAM + 32GB ROM, 6GB RAM + 64GB ROM, 4GB RAM + 64GB ROM, and 6GB RAM + 128GB ROM models. All have the force gold colors, and other colors of each model are slightly different.

Here are some LeTV LeEco Pro 3 force gold images.

Source from:http://www.letvmobileshop.com/news/letv-leeco-le-pro-3-has-been-released/

LeEco Le 2S Pro 6GB Snapdragon 821 Phone exposed

Previous rumors showed that there will be two versions of LeEco Le 2S Pro or Le Pro 3 mobile released, including 6GB RAM + 64GB ROM and 8GB RAM + 256GB ROM storage. Today the model of LeTV LEX720 6GB version has appeared on GeekBench. According to the AnTuTu data, this mobile is carried with Snapdragon 821 processor, and pre-installed with the latest Android 6.0.1 Marshmallow OS.
According to the current infos, the LeTV Le 2s Pro 6GB version smartphone will build in a 4070mAh battery, and 8GB version for 5000mAh large capacity battery. LeTV Phone has confirmed it will hold a New Product Releasing Conference on September 21 in Beijing, and the LeEco new model will be debut then. More news please stay tuned for our later reports.

Source from: http://www.letvmobileshop.com/news/leeco-le-2s-pro-6gb-snapdragon-821-phone-exposed/

LeTV confirm to hold a new conference on Sep 21

LeTV has recently announced that it will hold a new conference on September 21. According to the previous news, the new LeTV Flagship will be named as LeTV Le Pro 3, which is expected to be first equipped with Snapdragon 821 processor, has 6GB RAM, 64GB ROM, 16MP back camera + 8MP front camera. The new Letv phone AnTuTu Benchmark even reaches up to 163546 scores.
In addition, the battery capacity will have an significant upgrade, which will built in a 5000mAh large capacity battery with 7mm ultra-thin fuselage.

Source from: http://www.letvmobileshop.com/news/letv-confirm-to-hold-a-new-conference-on-sep-21/

LeTV will first launch Snapdragon 821 Phone on Sep 21

Rumors about the LeTV new mobile showed that this new product will first carry the Snapdragon 821 processor, and now LeTV Official has confirmed it will hold a new conference on September 21.

It is said that the LeEco new product will be equipped with a 5.5 inch 1080P screen, carried with Snapdragon 821 2.3GHz processor, and builds in 4GB RAM + 32GB ROM at least, has 8.0MP front camera, and 16.0MP back camera. This new mobile also built in back fingerprint recognition module, and pre-installed with the latest Android 6.0.1 OS.

As for the name of this new LeTV Mobile, some said it is LeTV Le 2S Pro, and other said it is LeTV Le Pro 3 mobile.

Source from: http://www.letvmobileshop.com/news/letv-will-first-launch-snapdragon-821-phone-on-sep-21/

LeEco Le 2S Full Specs Exposed: Still Helio X25 CPU

LeEco Le X652 model has appeared on Ministry website, which indicated that the LeTV new machine with "Face" design will come soon.

The inner model Le X652 new machine is more expected to be LeTV Le 2S, while previous news showed that the Le 2S will come with Snapdragon 821 processor, which will not come ture. According to the network Information, it will still carry the MTK octa core processor as the previous LeTV Le 2 and Le 2 Pro mobiles.

Le X652 data showed that it will carry Helio X25/MT6797T octa core 2.5GHz processor. As for the Snapdragon 821 mobile, it is more probably to be the LeEco Le 2S Pro or LeEco Pro 3 model.

The new LeTV machine has many attractive points on its appearance design. The unique back "Face" design, and adopts full new metal body + new antenna technology, the back style has a big difference as its previous models. Moreover, it has a 3900mAh large capacity battery under 7.5mm ultra-thin fuselage.

LeEco Le X652 mobile has 3GB RAM + 32GB ROM, uses a 5.5 inch 1080P screen, pre-installed with Android 6.0 OS, ans support fingerprint recognition and full network. As for the camera specs, it has 2*13.0MP dual rear cameras + 8.0MP front camera.

Except for new coming LeTV Mobile, LeTV will also hold a Promotion on September 19, and the LeTV Le 2S is expected to appear hen.

Source from:http://www.letvmobileshop.com/news/leeco-l-2s-full-specs-exposed-still-helio-x25-cpu/

LeEco Pro 3 New Phone will first use Snapdragon 821 CPU

LeTV has ever announced it will launch two new Super phones, which are named as LeEco Le 2S and Le 2S Pro.

Especially the LeTV Le 2S pro, it is ecpected to first use the Snapdragon 821 processor,and the AnTuTu benchmarch even up to 157,000.
However, according to AnTuTu's latest news, the new LeTV machine will be named as LeEco Pro 3, equipped with Snapdragon 821 processor, builds in 6GB RAM, 64GB ROM, has 16.0MP back camera + 8.0MP front camera, and the AnTuTu benchmark is 163546 scores.

As for the LeTV LeEco Pro 3 model, it is on earth another name of the LeTV Le 2S pro, or another new high-end version LeTV phone, it is still unknown at present.

LeTV Pro, LeTV Le 2 Pro, LeTV Le 2S Pro, LeTV Pro 3, such a variety of name! 

Source from: http://www.letvmobileshop.com/news/leeco-pro-3-new-phone-will-first-use-snapdragon-821-cpu/