Except for the two new products that have been released in United States, LeTV Mobile is said to take a next big action -- a new product that will be loaded with LeAI artificial intelligence new concept is about to debut, that is the LeTV LeEco Dual 3 mobile with personalized dual-master design, which has been confirmed that it will be officially released on November.

Before LeTV Dual 3 phone release, there are many rumors about this smartphone. Recently several suspected LeTV Dual 3 phone spy phone photos have been exposed online, which first confirmed that the processor model of this phone.
LeTV Dual 3 Above photo is just the LeTV Dual 3 latest spy photo, from which we can see it is carried with EUI 5.8 OS, and Helio X27 deca core processor, with 2.6GHz main frequency.

However, LeTV Official has never announced any infos about the Helio X27 processor. Many thought it is the upgrade version of the Helio X25 processor, while X27 will have a better performance. But the process technology and three ten-core architecture of the Helio X27 will not change.
LeTV Dual 3 LeTV Dual 3 "Smile" face dual rear back camera design is very attracting. Moreover, it also first adopts the famous curved antenna technology, which is very different from its previous models of LeTV Le 2.

Source from: http://www.letvmobileshop.com/news/letv-leeco-dual-3-comes-with-helio-x27-cpu/