Thursday, September 1, 2016

LeEco Le 2S Full Specs Exposed: Still Helio X25 CPU

LeEco Le X652 model has appeared on Ministry website, which indicated that the LeTV new machine with "Face" design will come soon.

The inner model Le X652 new machine is more expected to be LeTV Le 2S, while previous news showed that the Le 2S will come with Snapdragon 821 processor, which will not come ture. According to the network Information, it will still carry the MTK octa core processor as the previous LeTV Le 2 and Le 2 Pro mobiles.

Le X652 data showed that it will carry Helio X25/MT6797T octa core 2.5GHz processor. As for the Snapdragon 821 mobile, it is more probably to be the LeEco Le 2S Pro or LeEco Pro 3 model.

The new LeTV machine has many attractive points on its appearance design. The unique back "Face" design, and adopts full new metal body + new antenna technology, the back style has a big difference as its previous models. Moreover, it has a 3900mAh large capacity battery under 7.5mm ultra-thin fuselage.

LeEco Le X652 mobile has 3GB RAM + 32GB ROM, uses a 5.5 inch 1080P screen, pre-installed with Android 6.0 OS, ans support fingerprint recognition and full network. As for the camera specs, it has 2*13.0MP dual rear cameras + 8.0MP front camera.

Except for new coming LeTV Mobile, LeTV will also hold a Promotion on September 19, and the LeTV Le 2S is expected to appear hen.
LeTV Le 2S

Source from:http://www.letvmobileshop.com/news/leeco-l-2s-full-specs-exposed-still-helio-x25-cpu/

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