On CES2016, Letv has released the LeTV Le Max Pro mode, which is expected to be equipped with the world's first powered chip Snapdragon 820 Processor. And on the later MWX2016, Letv  officer disclosed Letv Le2 will be coming soon. Except for the Snapdragon 820, helio X20 and Ultrasonic fingerprint, it will also introduce a revolutionary technology.. It is said that the new model will have a big change on the body design. one of the biggest changes is the metal back cover with ceramic elements, and it will be released at the early April.
Letv Le2 LeTV Le 2 Back shell details
Letv Le2 LeTV Le 2 comes with Three-paragraph body design
Letv Le2 From the above photo we can see that this new Letv mobile has a large sreen, perhaps will be in line with previous rumors 5.7 inch screen specs, fingerprint on the back shell with three-segment body, and the upper and lower ends will adopt the ceramic material. In view of it, the Le2 is sure to be very beautiful, such a design remind us of the previous Huawei Ascend P7, and the newly released Xiaomi Mi5 mobiles.
Letv Le2 Logo is at the bottom of the back shell
Letv Le2 Letv Le2 Letv Le2 If no surprise, there will be at least two new Letv products will be debult on the conference, one is carried with MediaTek Helio X20 processor, the other with Snapdragon 820. Combination with the model of Le X820 and Le X620 / 621, they are expected to be upcoming two new products of LeTV Mobile, the latter of which will be equipped with Helio X20 processor.

Source from: http://www.letvmobileshop.com/news/letv-two-x620-features-metal-ceramics-shell/